ZHCSLE5Q February 2000 – January 2023 LM1117
PRODUCTION DATA
| 热指标(1) | LM1117、LM1117I | 单位 | |||||
|---|---|---|---|---|---|---|---|
| DCY (SOT-223) | NDE (TO-220) | NDP (TO-252) | NGN (WSON) | KTT (TO-263) | |||
| 4 个引脚 | 3 个引脚 | 3 个引脚 | 8 个引脚 | 3 个引脚 | |||
| RθJA | 结至环境热阻 | 61.6 | 23.8 | 45.1 | 39.3 | 41.3 | °C/W |
| RθJC(top) | 结至外壳（顶部）热阻 | 42.5 | 16.6 | 52.1 | 31.4 | 44.1 | °C/W |
| RθJB | 结至电路板热阻 | 10.4 | 5.3 | 29.8 | 16.5 | 24.2 | °C/W |
| ψJT | 结至顶部特征参数 | 2.9 | 3.1 | 4.5 | 0.3 | 10.9 | °C/W |
| ψJB | 结至电路板特征参数 | 10.3 | 5.3 | 29.4 | 16.7 | 23.2 | °C/W |
| RθJC(bot) | 结至外壳（底部）热阻 | — | 1.5 | 1.3 | 5.6 | 1.3 | °C/W |