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ZHCSJ12X October 1979 – October 2023 LM139 , LM139A , LM239 , LM239A , LM2901 , LM2901AV , LM2901B , LM2901V , LM339 , LM339A , LM339B

PRODMIX

请参考 PDF 数据表获取器件具体的封装图。

7.7 Thermal Information for LM339B and LM2901B

THERMAL METRIC⁽¹⁾		LM339B, LM2901B					UNIT
		D (SOIC)	PW (TSSOP)	DDY (SOT-23)	RUC (QFN)	RTE (QFN)
		14 PINS	14 PINS	14 PINS	14 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	111.2	136.6			67.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	66.9	66.6			72.3	°C/W
R_θJB	Junction-to-board thermal resistance	67.8	79.8			43.1	°C/W
ψ_JT	Junction-to-top characterization parameter	28.0	17.8			6.3	°C/W
ψ_JB	Junction-to-board characterization parameter	67.4	79.3			42.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	-	-	-		26.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report, SPRA953.