ZHCST88A September 2023 – October 2023 LM2104
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
THERMAL METRIC(1) | LM2104 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 133.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 75.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 76.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 25.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 75.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |