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ZHCS537P September 2008 – November 2014 LM22670 , LM22670-Q1

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

DDA|8
- MPDS092F
NDR|7
- MMSF023A

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings⁽¹⁾⁽³⁾

	MIN	MAX	UNIT
VIN to GND		43	V
EN Pin Voltage	–0.5	6
RT/SYNC Pin Voltage	–0.5	7
SW to GND⁽²⁾	–5	V_IN
BOOT Pin Voltage		V_SW + 7
FB Pin Voltage	–0.5	7
Power Dissipation	Internally Limited
Junction Temperature		150	°C
For soldering specifications, refer to Application Report Absolute Maximum Ratings for Soldering (SNOA549).

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and should not be operated beyond such conditions.

(2) The absolute maximum specification of the ‘SW to GND’ applies to dc voltage. An extended negative voltage limit of –10 V applies to a pulse of up to 50 ns.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 Handling Ratings: LM22670

			MIN	MAX	UNIT
T_stg	Storage temperature range		–65	150	°C
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾	–2	2	kV

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Handling Ratings: LM22670-Q1

				MIN	MAX	UNIT
T_stg	Storage temperature range			–65	150	°C
V_(ESD)	Electrostatic discharge	Human body model (HBM), per AEC Q100-002⁽¹⁾		–2	2	kV

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

		MIN	MAX	UNIT
V_IN	Supply Voltage	4.5	42	V
	Junction Temperature Range	–40	125	°C

6.5 Thermal Information

THERMAL METRIC⁽¹⁾⁽²⁾⁽³⁾		LM22670, LM22670-Q1		UNIT
THERMAL METRIC⁽¹⁾⁽²⁾⁽³⁾		DDA 8 PINS	NDR 7 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	60	22	°C/W

(1) For more information about traditional and new thermal metrics, see the application report IC Package Thermal Metrics (SPRA953).

(2) The value of R_θJA for the PFM package of 22°C/W is valid if package is mounted to 1 square inch of copper. The R_θJA value can range from 20 to 30 °C/W depending on the amount of PCB copper dedicated to heat transfer. See application note AN-1797 TO-263 THIN Package (SNVA328) for more information.

(3) The value of R_θJA for the SO Power PAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper. The R_θJA value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.

6.6 Electrical Characteristics

Typical values represent the most likely parametric norm at T_A = T_J = 25°C, and are provided for reference purposes only. Unless otherwise specified: V_IN = 12 V.

PARAMETER		TEST CONDITIONS	MIN⁽²⁾	TYP⁽¹⁾	MAX⁽²⁾	UNIT
LM22670-5.0
V_FB	Feedback Voltage	V_IN = 8 V to 42 V	4.925	5.0	5.075	V
V_FB	Feedback Voltage	V_IN = 8 V to 42 V, –40°C ≤ T_J ≤ 125°C	4.9		5.1	V
LM22670-ADJ
V_FB	Feedback Voltage	V_IN = 4.7 V to 42 V	1.266	1.285	1.304	V
V_FB	Feedback Voltage	V_IN = 4.7 V to 42 V, –40°C ≤ T_J ≤ 125°C	1.259		1.311	V
ALL OUTPUT VOLTAGE VERSIONS
I_Q	Quiescent Current	V_FB = 5 V		3.4		mA
I_Q	Quiescent Current	V_FB = 5 V, –40°C ≤ T_J ≤ 125°C			6	mA
I_STDBY	Standby Quiescent Current	EN Pin = 0 V		25	40	µA
I_CL	Current Limit		3.4	4.2	5.3	A
I_CL	Current Limit	–40°C ≤ T_J ≤ 125°C	3.35		5.5	A
I_L	Output Leakage Current	V_IN = 42 V, EN Pin = 0 V, V_SW = 0 V		0.2	2	µA
I_L	Output Leakage Current	V_SW = –1 V		0.1	3	µA
R_DS(ON)	Switch On-Resistance	PFM Package		0.12	0.16	Ω
		PFM Package, –40°C ≤ T_J ≤ 125°C			0.22
		SO PowerPAD-8 Package		0.10	0.16
		SO PowerPAD-8 Package, –40°C ≤ T_J ≤ 125°C			0.20
f_O	Oscillator Frequency			500		kHz
f_O	Oscillator Frequency	–40°C ≤ T_J ≤ 125°C	400		600	kHz
T_OFFMIN	Minimum Off-time			200		ns
T_OFFMIN	Minimum Off-time	–40°C ≤ T_J ≤ 125°C	100		300	ns
T_ONMIN	Minimum On-time			100		ns
I_BIAS	Feedback Bias Current	V_FB = 1.3 V (ADJ Version Only)		230		nA
V_EN	Enable Threshold Voltage	Falling		1.6		V
V_EN	Enable Threshold Voltage	Falling, –40°C ≤ T_J ≤ 125°C	1.3		1.9	V
V_ENHYST	Enable Voltage Hysteresis			0.6		V
I_EN	Enable Input Current	EN Input = 0 V		6		µA
F_SYNC	Maximum Synchronization Frequency	V_SYNC = 3.5 V, 50% duty-cycle		1		MHz
V_SYNC	Synchronization Threshold Voltage			1.75		V
T_SD	Thermal Shutdown Threshold			150		°C

(1) Typical values represent most likely parametric norms at the conditions specified and are not ensured.

(2) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI's Average Outgoing Quality Level (AOQL).