SNOSBI2C June   1999  – September 2015 LM231 , LM331

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description continued
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Detail of Operation, Functional Block Diagram
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Simplified Voltage-to-Frequency Converter
      2. 9.1.2 Principles of Operation
    2. 9.2 Typical Applications
      1. 9.2.1 Basic Voltage-to-Frequency Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Precision V-To-F Converter
    3. 9.3 System Examples
      1. 9.3.1 F-to-V Converters
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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11 Layout

11.1 Layout Guidelines

Bypass capacitors must be placed as close as possible to the supply pin. As the LM331 is a through-hole device, it is acceptable to place the bypass capacitor on the bottom layer.

If an input capacitor to ground is used to clean the input signal, the capacitor should be placed close to the supply pin.

Use of a ground plane is recommended to provide a low-impedance ground across the circuit.

11.2 Layout Example

LM231 LM331 layout_example.gif Figure 31. Layout Example