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SNIS160E May 1999 – February 2015 LM135 , LM135A , LM235 , LM235A , LM335 , LM335A

PRODUCTION DATA.

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- MMSF004B

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽³⁾⁽²⁾⁽⁴⁾

		MIN	MAX	UNIT
Reverse Current			15	mA
Forward Current			10	mA
Storage temperature, T_stg	8-Pin SOIC Package	−65	150	°C
Storage temperature, T_stg	TO / TO-92 Package	−60	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3) Refer to RETS135H for military specifications.

(4) Soldering process must comply with the Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	NOM	MAX	UNIT
Specified Temperature	LM135, LM135A	Continuous (T_MIN ≤ T_A ≤ T_MAX)	−55		150	°C
	LM135, LM135A	Intermittent ⁽¹⁾	150		200	°C
	LM235, LM235A	Continuous (T_MIN ≤ T_A ≤ T_MAX)	−40		125	°C
	LM235, LM235A	Intermittent ⁽¹⁾	125		150	°C
	LM335, LM335A	Continuous (T_MIN ≤ T_A ≤ T_MAX)	−40		100	°C
	LM335, LM335A	Intermittent ⁽¹⁾	100		125	°C
Forward Current			0.4	1	5	mA

(1) Continuous operation at these temperatures for 5,000 hours for LP package may decrease life expectancy of the device.

6.3 Thermal Information

THERMAL METRIC⁽¹⁾		LM335 / LM335A	LM235 / LM235A	LM135 / LM135A	UNIT
		SOIC (D)	TO-92 (LP)	TO-46 (NDV)
		8 PINS	3 PINS	3 PINS
R_θJA	Junction-to-ambient thermal resistance	165	202	400	°C/W
R_θJC	Junction-to-case thermal resistance	—	170	—	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Temperature Accuracy: LM135/LM235, LM135A/LM235A⁽¹⁾

PARAMETER		TEST CONDITIONS	LM135A/LM235A			LM135/LM235			UNIT
PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	MIN	TYP	MAX	UNIT
Operating Output Voltage		T_C = 25°C, I_R = 1 mA	2.97	2.98	2.99	2.95	2.98	3.01	V
Uncalibrated Temperature Error		T_C = 25°C, I_R = 1 mA		0.5	1		1	3	°C
Uncalibrated Temperature Error		T_MIN ≤ T_C ≤ T_MAX, I_R = 1 mA		1.3	2.7		2	5	°C
Temperature Error with 25°C		T_MIN ≤ T_C ≤ T_MAX, I_R = 1 mA		0.3	1		0.5	1.5	°C
Calibration	Calibrated Error at Extended	T_C = T_MAX (Intermittent)		2			2		°C
Temperature	Non-Linearity	I_R = 1 mA		0.3	0.5		0.3	1	°C

6.5 Temperature Accuracy: LM335, LM335A⁽¹⁾

PARAMETER		TEST CONDITIONS	LM335A			LM335			UNIT
PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	MIN	TYP	MAX	UNIT
Operating Output Voltage		T_C = 25°C, I_R = 1 mA	2.95	2.98	3.01	2.92	2.98	3.04	V
Uncalibrated Temperature Error		T_C = 25°C, I_R = 1 mA		1	3		2	6	°C
Uncalibrated Temperature Error		T_MIN ≤ T_C ≤ T_MAX, I_R = 1 mA		2	5		4	9	°C
Temperature Error with 25°C		T_MIN ≤ T_C ≤ T_MAX, I_R = 1 mA		0.5	1		1	2	°C
Calibration	Calibrated Error at Extended	T_C = T_MAX (Intermittent)		2			2		°C
Temperature	Non-Linearity	I_R = 1 mA		0.3	1.5		0.3	1.5	°C

6.6 Electrical Characteristics

See ⁽¹⁾.

PARAMETER	TEST CONDITIONS	LM135/LM235/LM135A/LM235A			LM335/LM335A			UNIT
PARAMETER	TEST CONDITIONS	MIN	TYP	MAX	MIN	TYP	MAX	UNIT
Operating Output Voltage Change with Current	400 μA ≤ I_R ≤ 5 mA, At Constant Temperature		2.5	10		3	14	mV
Dynamic Impedance	I_R = 1 mA		0.5			0.6		Ω
Output Voltage Temperature Coefficient			10			10		mV/°C
Time Constant	Still Air		80			80		sec
	100 ft/Min Air		10			10		sec
	Stirred Oil		1			1		sec
Time Stability	T_C = 125°C		0.2			0.2		°C/khr