ZHCSGG8F July   2011  – March 2018 LM25118

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
      2.      效率与输入电压和输出电流（输出电压 = 12V）
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 UVLO
      2. 7.3.2 Oscillator and Sync Capability
      3. 7.3.3 Error Amplifier and PWM Comparator
      4. 7.3.4 Ramp Generator
      5. 7.3.5 Current Limit
      6. 7.3.6 Maximum Duty Cycle
      7. 7.3.7 Soft Start
      8. 7.3.8 HO Output
      9. 7.3.9 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Buck Mode Operation: VIN > VOUT
      2. 7.4.2 Buck-Boost Mode Operation: VIN ≊ VOUT
      3. 7.4.3 High Voltage Start-Up Regulator
      4. 7.4.4 Enable
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  R7 = RT
        3. 8.2.2.3  Inductor Selection – L1
        4. 8.2.2.4  R13 = RSENSE
        5. 8.2.2.5  C15 = CRAMP
        6. 8.2.2.6  Inductor Current Limit Calculation
        7. 8.2.2.7  C9 - C12 = Output Capacitors
        8. 8.2.2.8  D1
        9. 8.2.2.9  D4
        10. 8.2.2.10 C1 – C5 = Input Capacitors
        11. 8.2.2.11 C20
        12. 8.2.2.12 C8
        13. 8.2.2.13 C16 = CSS
        14. 8.2.2.14 R8, R9
        15. 8.2.2.15 R1, R3, C21
        16. 8.2.2.16 R2
        17. 8.2.2.17 Snubber
        18. 8.2.2.18 Error Amplifier Configuration
          1. 8.2.2.18.1 R4, C18, C17
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bias Power Dissipation Reduction
    2. 9.2 Thermal Considerations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN, EN, VOUT to GND –0.3 45 V
VCC, LO, VCCX, UVLO to GND –0.3 16 V
HB to HS –0.3 16 V
HO to HS –0.3 HB + 0.3 V
HS to GND –4 45 V
CSG, CS to GND –0.3 0.3 V
RAMP, SS, COMP, FB, SYNC, RT to GND –0.3 7 V
Junction temperature –40 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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