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ZHCS519G April 2000 – May 2019 LM2585

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

NDH|5
- MMSF011
KTT|5
- MPSF007E

散热焊盘机械数据 (封装 | 引脚)

KTT|5
- PPTD277

订购信息

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM2585		UNIT
		KTT (DDPAK/TO-263	NDH (TO-220)
		5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	56⁽²⁾	65⁽³⁾	°C/W
		35⁽⁴⁾	45⁽⁵⁾
		26⁽⁶⁾	—
R_θJC	Junction-to-case thermal resistance	2	2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.

(2) Junction-to-ambient thermal resistance for the 5-lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.

(3) Junction-to-ambient thermal resistance (no external heat sink) for the 5-lead TO-220 package mounted vertically, with ½ inch leads in a socket, or on a PC board with minimum copper area.

(4) Junction-to-ambient thermal resistance for the 5-lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches (3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.

(5) Junction-to-ambient thermal resistance (no external heat sink) for the 5-lead TO-220 package mounted vertically, with ½ inch leads soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.

(6) Junction-to-ambient thermal resistance for the 5-lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance further.