SNVS074E May   2001  – May 2016 LM2591HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics LM2591HV-3.3
    6. 7.6 Electrical Characteristics LM2591HV-5.0
    7. 7.7 Electrical Characteristics LM2591HV-ADJ
    8. 7.8 Electrical Characteristics All Output Voltage Versions
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Delayed Start-Up
      2. 9.3.2 Undervoltage Lockout
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 Active Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Feedforward Capacitor
      2. 10.1.2 Input Capacitor
      3. 10.1.3 Output Capacitor
      4. 10.1.4 Catch Diode
      5. 10.1.5 Inverting Regulator
      6. 10.1.6 Inverting Regulator Shutdown Methods
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Inductor Selection Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (April 2013) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from C Revision (April 2013) to D Revision

  • Changed layout of National Data Sheet to TI formatGo
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