SNVS118F december   1999  – may 2023 LM2594 , LM2594HV

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics – 3.3 V
    6. 7.6  Electrical Characteristics – 5 V
    7. 7.7  Electrical Characteristics – 12 V
    8. 7.8  Electrical Characteristics – Adjustable
    9. 7.9  Electrical Characteristics – All Output Voltage Versions
    10. 7.10 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Delayed Start-Up
      2. 8.3.2 Undervoltage Lockout
      3. 8.3.3 Inverting Regulator
      4. 8.3.4 Inverting Regulator Shutdown Methods
    4. 8.4 Device Functional Modes
      1. 8.4.1 Discontinuous Mode Operation
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Capacitor (CIN)
      2. 9.1.2 Output Capacitor (COUT)
      3. 9.1.3 Catch Diode
      4. 9.1.4 Inductor Selection
      5. 9.1.5 Output Voltage Ripple and Transients
      6. 9.1.6 Open Core Inductors
    2. 9.2 Typical Applications
      1. 9.2.1 Series Buck Regulator (Fixed Output)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Inductor Selection (L1)
          3. 9.2.1.2.3 Output Capacitor Selection (COUT)
          4. 9.2.1.2.4 Catch Diode Selection (D1)
          5. 9.2.1.2.5 Input Capacitor (CIN)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Series Buck Regulator (Adjustable Output)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor Selection (COUT)
          4. 9.2.2.2.4 Feedforward Capacitor (CFF)
          5. 9.2.2.2.5 Catch Diode Selection (D1)
          6. 9.2.2.2.6 Input Capacitor (CIN)
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design with WEBENCH® Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)LM2594, LM2594HVUNIT
D (SOIC)P (PDIP)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance(2)(3)15095°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) The package thermal impedance is calculated in accordance to JESD 51-7.
(3) Thermal resistances were simulated on a 4 -layer, JEDEC board.
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