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SNIS115S May 2001 – September 2015 LM26

PRODUCTION DATA.

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机械数据 (封装 | 引脚)

DBV|5
- MPDS018T

散热焊盘机械数据 (封装 | 引脚)

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
Input Voltage				6	V
Input Current at any pin ⁽²⁾				5	mA
Package Input Current ⁽²⁾				20	mA
Package Dissipation at T_A = 25°C⁽³⁾				500	mW
Soldering Information⁽⁴⁾	SOT-23 Package	Vapor Phase (60 seconds)		215	°C
Soldering Information⁽⁴⁾	SOT-23 Package	Infrared (15 seconds)		220	°C
Storage Temperature, T_stg			−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) When the input voltage (V_I) at any pin exceeds the power supply (V_I < GND or V_I > V⁺), the current at that pin should be limited to 5 mA. The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.

(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T_JMAX (maximum junction temperature), θ_JA (junction to ambient thermal resistance) and T_A (ambient temperature). The maximum allowable power dissipation at any temperature is P_D = (T_JMAX–T_A) / θ_JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, T_JMAX = 150°C. For this device the typical thermal resistance (θ_JA) of the different package types when board mounted follow:

(4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge⁽¹⁾	Human body model (HBM)	±2500	V
V_(ESD)	Electrostatic discharge⁽¹⁾	Machine Model	±250	V

(1) The human body model is a 100-pF capacitor discharge through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Specified Temperature Range (T_MIN ≤ T_A ≤ T_MAX)	−55	125	°C
Positive Supply Voltage (V⁺)	2.7	5.5	V
Maximum V_OUT		5.5	V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM26	UNIT
		DBV (SOT-23)
		5 PINS
R_θJA	Junction-to-ambient thermal resistance	250	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

The following specifications apply for V⁺ = 2.7 V_DC to 5.5 V_DC, and V_TEMP load current = 0 µA unless otherwise specified. All limits apply for T_A = T_J = T_MIN to T_MAX unless otherwise specified.

PARAMETER		TEST CONDITIONS		MIN⁽²⁾	TYP⁽¹⁾	MAX⁽²⁾	UNIT
TEMPERATURE SENSOR
	Trip Point Accuracy (Includes V_REF, DAC, Comparator Offset, and Temperature Sensitivity errors)	–55°C ≤ T_A ≤ +110°C				±3	°C
		T_A = +120°C				±4	°C
	Trip Point Hysteresis	HYST = GND			11		°C
	Trip Point Hysteresis	HYST = V⁺			2		°C
	V_TEMP Output Temperature Sensitivity				−10.82		mV/°C
	V_TEMP Temperature Sensitivity Error to Equation: V_O = (−3.479 × 10⁻⁶ × (T − 30)²) + (−1.082 × 10⁻² × (T − 30)) + 1.8015 V	−30°C ≤ T_A ≤ 120°C				±3	°C
		−55°C ≤ T_A ≤ 120°C,	4.5 V ≤ V⁺ ≤ 5.5 V			±3	°C
		T_A = 30°C				±2.5	°C
	V_TEMP Load Regulation	Source ≤ 1 μA			0.070		mV
	V_TEMP Load Regulation	Sink ≤ 40 μA				0.7	mV
	V_TEMP Line Regulation	+2.7 V ≤ V⁺ ≤ +5.5 V, −30°C ≤ T_A ≤ +120°C			−0.2		mV/V
I_S	Supply Current	T_A = 25°C			16	20	µA
I_S	Supply Current					40	µA
DIGITAL OUTPUT AND INPUT
I_OUT(1)	Logical 1 Output Leakage Current ⁽⁴⁾	T_A = 25°C	V⁺ = +5.0 V		0.001	1	µA
V_OUT(0)	Logical 0 Output Voltage	I_OUT = +1.2 mA and V⁺≥ 2.7 V; I_OUT = +3.2 mA and V⁺ ≥ 4.5 V⁽³⁾				0.4	V
V_OUT(1)	Logical 1 Push-Pull Output Voltage	I_SOURCE = 500 µA, V⁺ ≥ 2.7 V		0.8 × V⁺			V
V_OUT(1)	Logical 1 Push-Pull Output Voltage	I_SOURCE = 800 µA, V⁺≥ 4.5 V		V⁺− 1.5			V
V_IH	HYST Input Logical 1 Threshold Voltage			0.8 × V⁺			V
V_IL	HYST Input Logical 0 Threshold Voltage					0.2 × V⁺	V

(1) Typicals are at T_J = T_A = 25°C and represent most likely parametric norm.

(2) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).

(3) Take care to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would increase by 1.28 mW when I_OUT = 3.2 mA and V_OUT = 0.4 V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.

(4) The 1-µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1-nA typical current at 25°C would increase to 16 nA at 85°C.

7.6 Typical Characteristics

Figure 1. Power Supply Current Temperature Dependence