SNVS457D February   2007  – October 2015 LM26400Y

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overcurrent Protection
      2. 7.3.2 Loop Stability
      3. 7.3.3 Load Step Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-Up and Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM26400Y Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM26400Y Design Example 2
  9. 9 Power Supply Recommendations
    1. 9.1 Low Input Voltage Considerations
    2. 9.2 Programming Output Voltage
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Shutdown
      2. 10.1.2 Power Loss Estimation
      3. 10.1.3 Inductor Selection
      4. 10.1.4 Output Capacitor Selection
      5. 10.1.5 Input Capacitor Selection
      6. 10.1.6 Catch Diode Selection
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from C Revision (April 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from B Revision (April 2013) to C Revision

  • Changed layout of National Data Sheet to TI formatGo
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