ZHCSRY0M april   2000  – may 2023 LM2676

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: LM2676 – 3.3 V
    6. 6.6  Electrical Characteristics: LM2676 – 5 V
    7. 6.7  Electrical Characteristics: LM2676 – 12 B
    8. 6.8  Electrical Characteristics: LM2676 – Adjustable
    9. 6.9  Electrical Characteristics – All Output Voltage Versions
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switch Output
      2. 7.3.2 Input
      3. 7.3.3 C Boost
      4. 7.3.4 Ground
      5. 7.3.5 Feedback
      6. 7.3.6 ON/OFF
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Design Considerations
      2. 8.1.2 Inductor
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Boost Capacitor
      7. 8.1.7 Additional Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application for All Output Voltage Versions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection Guides
          2. 8.2.1.2.2 Inductor Selection Guides
      2. 8.2.2 Application Curves
      3. 8.2.3 Fixed Output Voltage Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Capacitor Selection
      4. 8.2.4 Adjustable Output Voltage Application
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Capacitor Selection
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 DAP (VSON Package)

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8 Application and Implementation

Note:

以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
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