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ZHCSRY0M april 2000 – may 2023 LM2676

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

KTW|7
- MPSF015
NDZ|7
- MMSF005
NHM|14
- MPDS422

散热焊盘机械数据 (封装 | 引脚)

KTW|7
- PPTD278

订购信息

6.4 Thermal Information

THERMAL METRIC⁽¹⁾			LM2678			UNIT
			NDZ (TO-220)	KTW (TO-263)	NHM (VSON)
			7 PINS	7 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	See ⁽²⁾	65	—	—	°C/W
		See ⁽³⁾	45	—	—
		See ⁽⁴⁾	—	56	—
		See ⁽⁵⁾	—	35	—
		See ⁽⁶⁾	—	26	—
		See ⁽⁷⁾	—	—	55
		See ⁽⁸⁾	—	—	29
R_θJC(top)	Junction-to-case (top) thermal resistance		2	2	—	°C/W

(1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with 0.5 in leads in a socket, or on a PCB with minimum copper area.

(3) Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with 0.5 in leads soldered to a PCB containing approximately 4 square inches of (1 oz) copper area surrounding the leads.

(4) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.136 square inches (the same size as the DDPAK package) of 1 oz (0.0014 in thick) copper.

(5) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.4896 square inches (3.6 times the area of the DDPAK package) of 1 oz (0.0014 in thick) copper.

(6) Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB copper area of 1.0064 square inches (7.4 times the area of the DDPAK 3 package) of 1 oz (0.0014 in thick) copper. Additional copper area reduces thermal resistance further.

(7) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area equal to the die attach paddle.

(8) Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area using 12 vias to a second layer of copper equal to die attach paddle. Additional copper area reduces thermal resistance further. For layout recommendations, see the AN-1187 Leadless Leadfram Package (LLP) application report.