SNVS153F May   2001  – September 2016 LM2698

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inductor
      2. 7.3.2 Current Limit
      3. 7.3.3 Diode
      4. 7.3.4 Input Capacitor
      5. 7.3.5 Output Capacitor
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conduction Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.25-MHz Boost Converter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Compensation
            1. 8.2.1.2.1.1 Quick Compensator Design
            2. 8.2.1.2.1.2 Improving Transient Response Time
            3. 8.2.1.2.1.3 Additional Comments on the Open Loop Frequency Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 3.3-V SEPIC
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Level-Shifted SEPIC
        1. 8.2.3.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from E Revision (April 2013) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table, see POA at the end of the datasheet. Go
  • Changed values in the Thermal Information table to align with JEDEC standardsGo

Changes from D Revision (April 2013) to E Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo
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