SNIS144G July   2007  – September 2016 LM26LV , LM26LV-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM26LV
    3. 6.3 ESD Ratings: LM26LV-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Accuracy Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM26LV and LM26LV-Q1 VTEMP vs Die Temperature Conversion Table
      2. 7.3.2 VTEMP vs Die Temperature Approximations
        1. 7.3.2.1 The Second-Order Equation (Parabolic)
        2. 7.3.2.2 The First-Order Approximation (Linear)
        3. 7.3.2.3 First-Order Approximation (Linear) Over Small Temperature Range
      3. 7.3.3 OVERTEMP and OVERTEMP Digital Outputs
        1. 7.3.3.1 OVERTEMP Open-Drain Digital Output
          1. 7.3.3.1.1 Determining the Pullup Resistor Value
            1. 7.3.3.1.1.1 Example Calculation
      4. 7.3.4 TRIP_TEST Digital Input
      5. 7.3.5 VTEMP Analog Temperature Sensor Output
        1. 7.3.5.1 Noise Considerations
        2. 7.3.5.2 Capacitive Loads
        3. 7.3.5.3 Voltage Shift
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Input Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Noise Immunity
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Mounting and Temperature Conductivity
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

NGF Package
6-Pin WSON
Top View

Pin Functions

PIN TYPE DESCRIPTION EQUIVALENT CIRCUIT
NAME NO.
GND 2 GND Power supply ground —
OVERTEMP 5 O Overtemperature switch output. Active high, push-pull.
Asserted when the measured temperature exceeds the trip point temperature or if TRIP_TEST = 1. This pin may be left open if not used.		 LM26LV LM26LV-Q1 20204720.gif
OVERTEMP 3 O Overtemperature switch output. Active low, open-drain (See Determining the Pullup Resistor Value).
Asserted when the measured temperature exceeds the trip point temperature or if TRIP_TEST = 1. This pin may be left open if not used.		 LM26LV LM26LV-Q1 20204721.gif
TRIP_TEST 1 I TRIP_TEST pin. Active high input.
If TRIP_TEST = 0 (Default) then: VTEMP = VTS, temperature sensor output voltage.
If TRIP_TEST = 1 then: OVERTEMP and OVERTEMP outputs are asserted and VTEMP = VTRIP, temperature trip voltage.
This pin may be left open if not used.		 LM26LV LM26LV-Q1 20204738.gif
VDD 4 PWR Positive supply voltage —
VTEMP 6 O VTEMP analog voltage output.
If TRIP_TEST = 0 then: VTEMP = VTS, temperature sensor output voltage.
If TRIP_TEST = 1 then: VTEMP = VTRIP, temperature trip voltage.
This pin may be left open if not used.		 LM26LV LM26LV-Q1 20204739.gif
Thermal Pad — — The best thermal conductivity between the device and the PCB is achieved by soldering the DAP of the package to the thermal pad on the PCB. The thermal pad can be a floating node. However, for improved noise immunity the thermal pad must be connected to the circuit GND node, preferably directly to pin 2 (GND) of the device. —
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