SNVS497F November   2008  – September 2016 LM27341 , LM27341-Q1 , LM27342 , LM27342-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2  Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Function
      2. 7.3.2 Low Input Voltage Considerations
      3. 7.3.3 High Output Voltage Considerations
      4. 7.3.4 Frequency Synchronization
      5. 7.3.5 Current Limit
      6. 7.3.6 Frequency Foldback
      7. 7.3.7 Output Overvoltage Protection
      8. 7.3.8 Undervoltage Lockout
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
      2. 7.4.2 Soft-Start Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Inductor Selection
        1. 8.1.1.1 Inductor Calculation Example
      2. 8.1.2  Inductor Material Selection
      3. 8.1.3  Input Capacitor
      4. 8.1.4  Output Capacitor
      5. 8.1.5  Catch Diode
      6. 8.1.6  Boost Diode (Optional)
      7. 8.1.7  Boost Capacitor
      8. 8.1.8  Output Voltage
      9. 8.1.9  Feedforward Capacitor (Optional)
      10. 8.1.10 Calculating Efficiency and Junction Temperature
        1. 8.1.10.1 Schottky Diode Conduction Losses
        2. 8.1.10.2 Inductor Conduction Losses
        3. 8.1.10.3 MOSFET Conduction Losses
        4. 8.1.10.4 MOSFET Switching Losses
        5. 8.1.10.5 IC Quiescent Losses
        6. 8.1.10.6 MOSFET Driver Losses
        7. 8.1.10.7 Total Power Losses
        8. 8.1.10.8 Efficiency Calculation Example
        9. 8.1.10.9 Calculating Junction Temperature
          1. 8.1.10.9.1 Conduction
          2. 8.1.10.9.2 Convection
          3. 8.1.10.9.3 Method 1
          4. 8.1.10.9.4 Method 2
            1. 8.1.10.9.4.1 Method 2 Example
          5. 8.1.10.9.5 Method 3
            1. 8.1.10.9.5.1 Method 3 Example
    2. 8.2 Typical Applications
      1. 8.2.1 LM2734x Configuration From VIN = 7 V to 16 V, VOUT = 5 V For Full Load at 2 MHz
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LM2734x Configuration From VIN = 7 V to 16 V, VOUT = 5 V For Full Load at 1 MHz
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 LM2734x Configuration From VIN = 5 V to 16 V, VOUT = 3.3 V For Full Load at 2 MHz
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
      4. 8.2.4 LM2734x Configuration From VIN = 5 V to 16 V, VOUT = 3.3 V For Full Load at 2 MHz With SYNC = GND
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
        3. 8.2.4.3 Application Curves
      5. 8.2.5 LM2734x Configuration From VIN = 5 V to 16 V, VOUT = 3.3 V For Full Load at 2 MHz With SYNC = 1 MHz
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
        3. 8.2.5.3 Application Curves
      6. 8.2.6 LM2734x Configuration From VIN = 3.3 V to 16 V, VOUT = 1.8 V For Full Load at 2 MHz With SYNC = 1 GND
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
        3. 8.2.6.3 Application Curves
      7. 8.2.7 LM2734x Configuration From VIN = 3.3 V to 16 V, VOUT = 1.8 V For Full Load at 2 MHz With SYNC = 1 MHz
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
        3. 8.2.7.3 Application Curves
      8. 8.2.8 LM2734x Configuration From VIN = 3.3 V to 9 V, VOUT = 1.2 V For Full Load at 2 MHz With SYNC = 2 MHz
        1. 8.2.8.1 Design Requirements
        2. 8.2.8.2 Detailed Design Procedure
        3. 8.2.8.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout
      2. 10.1.2 Ground Plane and Shape Routing
      3. 10.1.3 FB Loop
      4. 10.1.4 PCB Summary
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from E Revision (April 2013) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed values in the Thermal Information table to align with JEDEC standardsGo

Changes from D Revision (April 2013) to E Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo
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