SNVS334F January   2005  – January 2016 LM2734Z , LM2734Z-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Theory of Operation
      2. 7.3.2 Boost Function
      3. 7.3.3 Soft-Start
      4. 7.3.4 Output Overvoltage Protection
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
      2. 7.4.2 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 LM2734Z Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Inductor Selection
          2. 8.2.1.2.2  Input Capacitor
          3. 8.2.1.2.3  Output Capacitor
          4. 8.2.1.2.4  Catch Diode
          5. 8.2.1.2.5  Boost Diode
          6. 8.2.1.2.6  Boost Capacitor
          7. 8.2.1.2.7  Output Voltage
          8. 8.2.1.2.8  Calculating Efficiency, and Junction Temperature
          9. 8.2.1.2.9  Calculating the LM2734Z Junction Temperature
          10. 8.2.1.2.10 WSON Package
          11. 8.2.1.2.11 Package Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 LM2734Z Design Example 2
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 LM2734Z Design Example 3
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 LM2734Z Design Example 4
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
      5. 8.2.5 LM2734Z Design Example 5
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from E Revision (April 2013) to F Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Removed soldering information Go

Changes from D Revision (April 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo
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