ZHCSIR2 September 2018 LM2735-Q1
PRODUCTION DATA.
- 1 特性
- 2 应用
- 3 说明
- 4 修订历史记录
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Applications
- 8.2.1 LM2735X-Q1 SOT-23 Design Example 1
- 8.2.2 LM2735Y-Q1 SOT-23 Design Example 2
- 8.2.3 LM2735X-Q1 WSON Design Example 3
- 8.2.4 LM2735Y-Q1 WSON Design Example 4
- 8.2.5 LM2735X-Q1 SOT-23 Design Example 6
- 8.2.6 LM2735Y-Q1 SOT-23 Design Example 7
- 8.2.7 LM2735X-Q1 SOT-23 Design Example 8
- 8.2.8 LM2735Y-Q1 SOT-23 Design Example 9
- 8.2.9 LM2735X-Q1 WSON Design Example 10
- 8.2.10 LM2735Y-Q1 WSON Design Example 11
- 8.2.11 LM2735X-Q1 WSON SEPIC Design Example 12
- 8.2.12 LM2735X-Q1 SOT-23 LED Design Example 14
- 8.2.13 LM2735Y-Q1 WSON FlyBack Design Example 15
- 8.2.14 LM2735X-Q1 SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
- 8.2.15 LM2735X-Q1 SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
- 8.2.16 SEPIC Converter
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文档支持
- 12机械、封装和可订购信息
10.3.3 LM2735-Q1 Thermal Models
Heat is dissipated from the LM2735-Q1 and other devices. The external loss elements include the Schottky diode, inductor, and loads. All loss elements mutually increase the heat on the PCB, and therefore increase each other’s temperatures.
Figure 45. Thermal Schematic 
Figure 46. Associated Thermal Model