ZHCSIR2 September 2018 LM2735-Q1
PRODUCTION DATA.
PDissipation = 475 mW
TA at Shutdown = 139°C
TCase-Top at Shutdown = 155°C
RθJA WSON = 55°C/W
RψJC WSON = 21°C/W
WSON typical application produces RθJA numbers in the range of 50°C/W to 65°C/W, and RψJC varies from 18°C/W to 28°C/W. These values are for PCBs with two and four layer boards with 0.5-oz copper, and 4 to 6 thermal vias to bottom side ground plane under the DAP.
For 5-pin SOT-23 package typical applications, RθJA numbers range from 80°C/W to 110°C/W, and RψJC varies from 50°C/W to 65°C/W. These values are for PCBs with 2- and 4-layer boards with 0.5-oz copper, with 2 to 4 thermal vias from GND pin to bottom layer.
For typical thermal impedances and an ambient temperature maximum of 75°C: if the design requires more than 400 mW internal to the LM2735-Q1 be dissipated, or there is 750 mW of total power loss in the application, TI recommends using the 6-pin WSON package.
NOTE
To use these procedures, it is important to dissipate an amount of power within the device to indicate a true thermal impedance value. If a very small internal dissipated value is used, it can be determined that the thermal impedance calculated is abnormally high, and subject to error. Figure 48 shows the nonlinear relationship of internal power dissipation vs RθJA.