6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
MAX |
UNIT |
Ground voltage, VIN to GND or GND to VOUT |
|
5.8 |
V |
EN |
(GND − 0.3 V) |
(VIN + 0.3 V) |
|
Continuous output current, CPOUT and VOUT |
|
300 |
mA |
TJMAX(3) |
|
150 |
°C |
Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/Distributors for availability and specifications.
(3) The maximum power dissipation must be de-rated at elevated temperatures and is limited by T
JMAX (maximum junction temperature), T
A (ambient temperature) and R
θJA (junction-to-ambient thermal resistance). The maximum power dissipation at any temperature is: P
DissMAX = (T
JMAX – T
A)/R
θJA up to the value listed in the
Absolute Maximum Ratings.
6.2 ESD Ratings
|
VALUE |
UNIT |
V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
±1000 |
V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) |
±250 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.