6.1 Absolute Maximum Ratings
See (1)(2)
|
MIN |
MAX |
UNIT |
| VIN |
–0.3 |
45 |
V |
| SHDN |
–0.3 |
(VIN + 0.3 V) < 45 |
V |
| SW voltage |
–0.3 |
45 |
V |
| CB voltage above SW voltage |
|
7 |
V |
| FB voltage |
–0.3 |
5 |
V |
| Power dissipation(3) |
Internally Limited |
|
| Maximum junction temperature |
|
150 |
°C |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under
Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA) / RθJA. Exceeding the maximum allowable power dissipation causes excessive die temperature, and the regulator goes into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=175°C (typical) and disengages at TJ= 155°C (typical).