ZHCSHO3L January 1989 – February 2018 LM285-2.5 , LM385-2.5 , LM385B-2.5
PRODUCTION DATA.
| THERMAL METRIC(1) | LMx85-2.5, LM385B-2.5 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | LP (T0-92) | PW (TSSOP) | |||
| 8 PINS | 3 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 112 | 157 | 168.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 58.5 | 80.3 | 53.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 52.1 | N/A | 96.4 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.8 | 24.6 | 4.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 51.7 | 136.2 | 94.7 | °C/W |