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ZHCSJ12X October 1979 – October 2023 LM139 , LM139A , LM239 , LM239A , LM2901 , LM2901AV , LM2901B , LM2901V , LM339 , LM339A , LM339B

PRODMIX

请参考 PDF 数据表获取器件具体的封装图。

7.8 Thermal Information for Non-B Versions

THERMAL METRIC⁽¹⁾		LMx39, LM2901x							UNIT
THERMAL METRIC⁽¹⁾		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)	J (CDIP)	W (CFP)	UNIT
R_θJA	Junction-to-ambient thermal resistance	98.8	111.8	79	96.2	120	89.5	156.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	64.3	63.6	73.4	56.1	59	46.1	86.7	°C/W
R_θJB	Junction-to-board thermal resistance	59.7	60.5	58.7	56.9	68.8	78.7	154.6	°C/W
ψ_JT	Junction-to-top characterization parameter	25.7	26.2	48.3	24.8	9.9	3	56.5	°C/W
ψ_JB	Junction-to-board characterization parameter	59.3	59.8	58.5	56.4	68.2	71.8	133.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	—	—	—	24.2	14.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.