ZHCSJ12X October   1979  – October 2023 LM139 , LM139A , LM239 , LM239A , LM2901 , LM2901AV , LM2901B , LM2901V , LM339 , LM339A , LM339B

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Other Versions
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings for  LM339B and LM2901B
    2. 7.2  Absolute Maximum Ratings for Non-B Versions
    3. 7.3  ESD Ratings for LM339B and LM2901B
    4. 7.4  ESD Ratings, Non-B Versions
    5. 7.5  Recommended Operating Conditions for LM339B and LM2901B
    6. 7.6  Recommended Operating Conditions, Non-B Versions
    7. 7.7  Thermal Information for LM339B and LM2901B
    8. 7.8  Thermal Information for Non-B Versions
    9. 7.9  Electrical Characteristics for LM339B
    10. 7.10 Electrical Characteristics for LM2901B
    11. 7.11 Electrical Characteristics for LM139 and LM139A
    12. 7.12 Electrical Characteristics for LMx39 and LMx39A
    13. 7.13 Electrical Characteristics for LM2901, LM2901V and LM2901AV
    14. 7.14 Switching Characteristics for LM139 and LM139A
    15. 7.15 Switching Characteristics for LM339B and LM2901B
    16. 7.16 Switching Characteristics for LMx39 and LMx39A
    17. 7.17 Switching Characteristics for LM2901
    18. 7.18 Typical Characteristics for LM339B and LM2901B Only
    19. 7.19 Typical Characteristics, Non-B Versions
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Voltage Comparison
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage Range
        2. 9.2.2.2 Minimum Overdrive Voltage
        3. 9.2.2.3 Output and Drive Current
        4. 9.2.2.4 Response Time
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Links
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • PW|14
  • NS|14
  • N|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.7 Thermal Information for LM339B and LM2901B

THERMAL METRIC(1) LM339B, LM2901B UNIT
D
(SOIC)		 PW
(TSSOP)		 DDY
(SOT-23)		 RUC
(QFN)		 RTE
(QFN)
14 PINS 14 PINS 14 PINS 14 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 111.2 136.6 67.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 66.9 66.6   72.3 °C/W
RθJB Junction-to-board thermal resistance 67.8 79.8   43.1 °C/W
ψJT Junction-to-top characterization parameter 28.0 17.8   6.3 °C/W
ψJB Junction-to-board characterization parameter 67.4 79.3   42.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance - - - 26.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics report, SPRA953.
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