ZHCSIA9L may   2003  – august 2023 LM2903-Q1 , LM2903B-Q1

PRODUCTION DATA  

  1.   1
  2.   特性
  3.   应用
  4.   说明
  5. 1Revision History
  6. 2Pin Configuration and Functions
    1. 2.1 Pin Functions
  7. 3Specifications
    1. 3.1  Absolute Maximum Ratings, LM2903-Q1 and LM2903E-Q1
    2. 3.2  Absolute Maximum Ratings, LM2903B-Q1
    3. 3.3  ESD Ratings, LM2903-Q1 and LM2903E-Q1
    4. 3.4  ESD Ratings, LM2903B-Q1
    5. 3.5  Recommended Operating Conditions, LM2903B-Q1
    6. 3.6  Recommended Operating Conditions, LM2903-Q1
    7. 3.7  Recommended Operating Conditions, LM2903E-Q1
    8. 3.8  Thermal Information, LM2903-Q1 and LM2903E-Q1
    9. 3.9  Thermal Information, LM2903B-Q1
    10. 3.10 Electrical Characteristics LM2903B - Q1
    11. 3.11 Switching Characteristics LM2903B - Q1
    12. 3.12 LM2903B-Q1 "T", "R" and "H" Temperature Test Options
    13. 3.13 Electrical Characteristics, LM2903-Q1 and LM2903E-Q1
    14. 3.14 Switching Characteristics, LM2903-Q1 and LM2903E-Q1
    15. 3.15 Typical Characteristics, LM2903-Q1 and LM2903E-Q1 Only
    16. 3.16 Typical Characteristics, LM2903B-Q1 Only
  8. 4Detailed Description
    1. 4.1 Overview
    2. 4.2 Functional Block Diagram
    3. 4.3 Feature Description
    4. 4.4 Device Functional Modes
      1. 4.4.1 Voltage Comparison
  9. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Typical Application
      1. 5.2.1 Design Requirements
      2. 5.2.2 Detailed Design Procedure
        1. 5.2.2.1 Input Voltage Range
        2. 5.2.2.2 Minimum Overdrive Voltage
        3. 5.2.2.3 Output and Drive Current
        4. 5.2.2.4 Response Time
      3. 5.2.3 Application Curves
    3. 5.3 Power Supply Recommendations
    4. 5.4 Layout
      1. 5.4.1 Layout Guidelines
      2. 5.4.2 Layout Example
  10. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 支持资源
    4. 6.4 Trademarks
    5. 6.5 静电放电警告
    6. 6.6 术语表
  11. 7Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DGK|8
  • PW|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

3.9 Thermal Information, LM2903B-Q1

THERMAL METRIC(1)LM2903B-Q1UNIT
D
(SOIC)		DGK
(VSSOP)		PW
(TSSOP)		DSG
(WSON)		DDF
(SOT-23)
8 PINS8 PINS8 PINS8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance148.5193.7200.696.9197.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance90.282.989.6119.0119.2
RθJBJunction-to-board thermal resistance91.8115.5131.363.1115.4
ψJTJunction-to-top characterization parameter38.520.822.112.419.4
ψJBJunction-to-board characterization parameter91.1113.9129.663.0113.7
RθJC(bot)Junction-to-case (bottom) thermal resistance---38.7-
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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