4 Revision History
Changes from C Revision (March 2013) to D Revision
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Added Pin Configuration and Functions section, ESD Rating table, Thermal Information table with updated values, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Changed θJA for SOIC from 140°C/W to 111.4°C/W; for TO-252 from 136°C/W to 50.5°C/W; for VSSOP from 200°C/W to 173.4°C/W; and for SOT-223 from149°C/W to 62.8°C/WGo
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Changed θJC for SOIC from 45°C/W to 56.3°C/W (top); TO-252 from 6°C/W to 52.6°C/W (top) and 1.6°C/W (bottom); SOT-223 from 36°C/W to 44.2°C/W (top) Go
Changes from B Revision (May 2012) to C Revision
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Changed layout of National Data Sheet to TI formatGo