SNVSAC2A March   2015  – June 2020 LM317A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Application
  3. 3 Description
    1.     Revision History
  4. 4 Device Comparison Table
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Load Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 External Capacitors
      2. 7.4.2 Protection Diodes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  1.25-V to 25-V Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2  5-V Logic Regulator With Electronic Shutdown
      3. 8.2.3  Slow Turnon 15-V Regulator
      4. 8.2.4  Adjustable Regulator With Improved Ripple Rejection
      5. 8.2.5  High-Stability 10-V Regulator
      6. 8.2.6  High-Current Adjustable Regulator
      7. 8.2.7  Emitter-Follower Current Amplifier
      8. 8.2.8  1-A Current Regulator
      9. 8.2.9  Common-Emitter Amplifier
      10. 8.2.10 Low-Cost 3-A Switching Regulator
      11. 8.2.11 Current-Limited Voltage Regulator
      12. 8.2.12 Adjusting Multiple On-Card Regulators With Single Control
      13. 8.2.13 AC Voltage Regulator
      14. 8.2.14 12-V Battery Charger
      15. 8.2.15 Adjustable 4-A Regulator
      16. 8.2.16 Current-Limited 6-V Charger
      17. 8.2.17 Digitally-Selected Outputs
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Considerations
        1. 10.1.1.1 Heatsink Requirements
        2. 10.1.1.2 Heatsinking Surface Mount Packages
          1. 10.1.1.2.1 Heatsinking the SOT-223 (DCY) Package
          2. 10.1.1.2.2 Heatsinking the TO-252 (NDP) Package
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1.2.1 Heatsinking the SOT-223 (DCY) Package

Figure 37 and Figure 38 show the information for the SOT-223 package. Figure 38 assumes a θJA of 74°C/W for 1-oz. copper and 59.6°C/W for 2-oz. copper and a maximum junction temperature of 125°C. See the AN-1028 Maximum Power Enhancement Techniques for Power Packages application note for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.

LM317A 906357.gifFigure 37. θJA vs Copper (2-oz.) Area for the SOT-223 Package
LM317A 906358.gifFigure 38. Maximum Power Dissipation vs TAMB for the SOT-223 Package
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