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SNVSAC2A March 2015 – June 2020 LM317A

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

NDP|3
- MMSF021A
DCY|4
- MPDS094A
NDE|3
- MMSF014
NDT|3
- MMSF002

散热焊盘机械数据 (封装 | 引脚)

DCY|4
- QFND222B

订购信息

10.1.1.2.2 Heatsinking the TO-252 (NDP) Package

If the maximum allowable value for θ_JA is found to be ≥54°C/W (typical rated value) for the TO-252 package, no heatsink is needed because the package alone will dissipate enough heat to satisfy these requirements. If the calculated value for θ_JA falls below these limits, a heatsink is required.

As a design aid, Table 1 shows the value of the θ_JA of NDP the package for different heatsink area. The copper patterns that we used to measure these θ_JAs are shown in Figure 43. Figure 39 reflects the same test results as what are in Table 1.

Figure 40 shows the maximum allowable power dissipation versus ambient temperature for the TO-252 device. Figure 41 shows the maximum allowable power dissipation versus copper area (in²) for the TO-252 device. See the AN-1028 Maximum Power Enhancement Techniques for Power Packages application note for thermal enhancement techniques to be used with SOT-223 and TO-252 packages.

Table 1. θ_JA Different Heatsink Area

Layout	Copper Area		Thermal Resistance
	Top Side (in²)⁽¹⁾	Bottom Side (in²)	(θ_JA°C/W) TO-252
1	0.0123	0	103
2	0.066	0	87
3	0.3	0	60
4	0.53	0	54
5	0.76	0	52
6	1	0	47
7	0.066	0.2	84
8	0.066	0.4	70
9	0.066	0.6	63
10	0.066	0.8	57
11	0.066	1	57
12	0.066	0.066	89
13	0.175	0.175	72
14	0.284	0.284	61
15	0.392	0.392	55
16	0.5	0.5	53