SNVSB95 July 2019 LM3421-Q1 , LM3423-Q1
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
VIN, EN, RPD, nDIM | –0.3 | 76 | V | |
–1 continuous | mA | |||
OVP, HSP, HSN, LRDY, FLT, DPOL | –0.3 | 76 | V | |
–100 continuous | µA | |||
RCT | –0.3 | 76 | V | |
–1 continuous | 5 continuous | mA | ||
IS | –0.3 | 76 | V | |
–2 for 100 ns | ||||
–1 continuous | mA | |||
VCC | –0.3 | 8 | V | |
TIMR | –0.3 | 7 | V | |
–100 continuous | 100 continuous | µA | ||
COMP, CSH | –0.3 | 6 | V | |
–200 continuous | 200 continuous | µA | ||
GATE, DDRV | –0.3 | VCC | V | |
–2.5 for 100 ns | VCC+ 2.5 for 100 ns | |||
–1 continuous | 1 continuous | mA | ||
PGND | –0.3 | 0.3 | V | |
–2.5 for 100 ns | 2.5 for 100 ns | |||
Continuous power dissipation | Internally Limited | |||
Maximum junction temperature | Internally Limited | |||
Maximum lead temperature (solder and reflow) (2) | 260 | °C | ||
Storage temperature | –65 | 150 | °C |