ZHCSK33G
July 2008 – July 2019
LM3421
,
LM3423
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
典型升压应用
4
修订历史记录
5
Device Comparison
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Current Regulators
8.3.2
Predictive Off-Time (PRO) Control
8.3.3
Average LED Current
8.3.4
Analog Dimming
8.3.5
Current Sense and Current Limit
8.3.6
Overcurrent Protection
8.3.7
Zero Current Shutdown
8.3.8
Control Loop Compensation
8.3.9
Start-Up Regulator
8.3.10
Overvoltage Lockout (OVLO)
8.3.11
Input Undervoltage Lockout (UVLO)
8.3.11.1
UVLO Only
8.3.11.2
PWM Dimming and UVLO
8.3.12
PWM Dimming
8.3.13
LM3423 Only: DPOL, FLT, TIMR, and LRDY
9
Application and Implementation
9.1
Application Information
9.1.1
Inductor
9.1.2
LED Dynamic Resistance
9.1.3
Output Capacitor
9.1.4
Input Capacitors
9.1.5
Main MOSFET / Dimming MOSFET
9.1.6
Re-Circulating Diode
9.1.7
Boost Inrush Current
9.1.8
Switching Frequency
9.2
Typical Applications
9.2.1
Basic Topology Schematics
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Operating Point
9.2.1.2.2
Switching Frequency
9.2.1.2.3
Average LED Current
9.2.1.2.4
Inductor Ripple Current
9.2.1.2.5
LED Ripple Current
9.2.1.2.6
Peak Current Limit
9.2.1.2.7
Loop Compensation
9.2.1.2.8
Input Capacitance
9.2.1.2.9
N-channel FET
9.2.1.2.9.1
Boost and Buck-Boost
9.2.1.2.10
Diode
9.2.1.2.11
Output OVLO
9.2.1.2.12
Input UVLO
9.2.1.2.13
PWM Dimming Method
9.2.1.2.14
Analog Dimming Method
9.2.2
LM3421 Buck-Boost Application
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Operating Point
9.2.2.2.2
Switching Frequency
9.2.2.2.3
Average LED Current
9.2.2.2.4
Inductor Ripple Current
9.2.2.2.5
Output Capacitance
9.2.2.2.6
Peak Current Limit
9.2.2.2.7
Loop Compensation
9.2.2.2.8
Input Capacitance
9.2.2.2.9
N-channel FET
9.2.2.2.10
Diode
9.2.2.2.11
Input UVLO
9.2.2.2.12
Output OVLO
9.2.2.3
Application Curve
9.2.3
LM3421 BOOST Application
9.2.3.1
Design Requirements
9.2.3.2
Detailed Design Procedure
9.2.4
LM3421 Buck-Boost Application
9.2.4.1
Design Requirements
9.2.4.2
Detailed Design Procedure
9.2.5
LM3423 Boost Application
9.2.5.1
Design Requirements
9.2.5.2
Detailed Design Procedure
9.2.6
LM3421 Buck-Boost Application
9.2.6.1
Design Requirements
9.2.6.2
Detailed Design Procedure
9.2.7
LM3423 Buck Application
9.2.7.1
Design Requirements
9.2.7.2
Detailed Design Procedure
9.2.8
LM3423 Buck-Boost Application
9.2.8.1
Design Requirements
9.2.8.2
Detailed Design Procedure
9.2.9
LM3421 SEPIC Application
9.2.9.1
Design Procedure
9.2.9.2
Detailed Design Procedure
10
Power Supply Recommendations
10.1
General Recommendations
10.2
Input Supply Current Limit
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
器件支持
12.1.1
第三方米6体育平台手机版_好二三四免责声明
12.2
相关链接
12.3
社区资源
12.4
商标
12.5
静电放电警告
12.6
Glossary
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
PWP|20
MHTS001G
散热焊盘机械数据 (封装 | 引脚)
PWP|20
PPTD289
订购信息
zhcsk33g_oa
zhcsk33g_pm
7.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
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