6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
|
MIN |
MAX |
UNIT |
| Voltage |
VIN, EN, nDIM |
–0.3 |
76 |
V |
| OVP, HSP, HSN |
–0.3 |
76 |
| IS |
–0.3 |
76 |
| –2 for 100 ns |
| VCC |
–0.3 |
8 |
| VS, TREF, TSENSE, TGAIN, COMP, CSH, RT, SLOPE, SS |
–0.3 |
6 |
| GATE, DDRV |
–0.3 |
VCC |
| –2.5 for 100 ns |
VCC + 2.5 for 100 ns |
| GND |
–0.3 |
0.3 |
| –2.5 for 100 ns |
2.5 for 100 ns |
| Continuous current |
VIN, EN, nDIM |
|
–1 |
mA |
| OVP, HSP, HSN |
|
–100 |
µA |
| IS |
|
–1 |
mA |
| SS |
–30 |
30 |
µA |
| GATE, DDRV |
–1 |
1 |
mA |
| Continuous power dissipation |
Internally Limited |
|
| Maximum Junction Temperature |
Internally Limited |
°C |
| Maximum lead temperature (Reflow and Solder)(3) |
|
260 |
°C |
| Storage temperature |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.