SNVSCV4 September   2024 LM3645

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Amplifier Synchronization (TORCH/TX)
      2. 6.3.2 Input Voltage Flash Monitor (IVFM)
      3. 6.3.3 Fault/Protections
        1. 6.3.3.1  Fault Operation
        2. 6.3.3.2  Flash Time-Out
        3. 6.3.3.3  Overvoltage Protection (OVP)
        4. 6.3.3.4  Current Limit
        5. 6.3.3.5  NTC Thermistor Input/Outputs (TEMP1, TEMP2)
        6. 6.3.3.6  Thermal Scale Back
        7. 6.3.3.7  Thermal Shutdown (TSD)
        8. 6.3.3.8  Undervoltage Lockout (UVLO)
        9. 6.3.3.9  LED and/or VOUT Short Fault
        10. 6.3.3.10 Fault Behavior Table
    4. 6.4 Device Functioning Modes
      1. 6.4.1 Flash Mode
      2. 6.4.2 Torch Mode
      3. 6.4.3 IR Mode
      4. 6.4.4 Voltage Mode
      5. 6.4.5 Mode Transitions
      6. 6.4.6 Boost Operation
        1. 6.4.6.1 Start-Up (Enabling The Device)
        2. 6.4.6.2 Pass Mode
        3. 6.4.6.3 Output Voltage Regulation
    5. 6.5 Programming and Control
      1. 6.5.1 Dx_EN Bits
      2. 6.5.2 STR1 and STR2 Usage
      3. 6.5.3 TOR/TX Usage
      4. 6.5.4 Control State Diagram
      5. 6.5.5 I2C-Compatible Interface
        1. 6.5.5.1 Data Validity
        2. 6.5.5.2 Start and Stop Conditions
        3. 6.5.5.3 Transferring Data
        4. 6.5.5.4 I2C-Compatible Chip Address
    6. 6.6 Register Descriptions
      1. 6.6.1 MainReg Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Output Control Examples
        1. 7.2.2.1 Four Channel Flash with Strobe1 Trigger Starting in Standby
        2. 7.2.2.2 Four Channel Flash with Strobe1 Trigger Starting in I2C Torch
        3. 7.2.2.3 Mixed Mode Functionality
        4. 7.2.2.4 Voltage Mode Only
        5. 7.2.2.5 Voltage Mode With Advanced IR
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Snubber Requirement
        2. 7.2.3.2 Output Capacitor Selection
        3. 7.2.3.3 Input Capacitor Selection
        4. 7.2.3.4 Inductor Selection
      4. 7.2.4 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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订购信息

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
VINNormal operation2.55.5V
Transient operation (no reset of the device)2.3
Junction temperature, TJ−40125°C
Ambient temperature, TA(3)−4085°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. Theseare stress ratings only, and functional operation of the device at these or any other conditionsbeyond those indicated under recommended operating conditions isnot implied. Exposure to absolute-maximum-rated conditions for extended periods may affect devicereliability.
(2) All voltages are with respect to the potential at the GNDterminal.
(3) In applications where high power dissipation and/or poor packagethermal resistance is present, the maximum ambient temperature may have to be derated. Maximumambient temperature (TA-MAX) is dependent on the maximum operating junctiontemperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the devicein the application (PD-MAX), and the junction-to-ambient thermal resistanceof the part/package in the application (RθJA), as given by the followingequation: TA-MAX = TJ-MAX-OP –(RθJA × PD-MAX).
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