ZHCSIU0D February   2000  – September 2018 LM4051-N

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1. 1.2 VREF 简化原理图
      2.      可调基准简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 LM4051-1.2 Electrical Characteristics
    6. 6.6 LM4051-ADJ Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 LM4051-N - 1.2 V
      2. 8.4.2 LM4051-N - ADJ
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Shunt Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Adjustable Shunt Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBZ|3
散热焊盘机械数据 (封装 | 引脚)

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Reverse current 20 mA
Forward current 10 mA
Maximum output voltage (LM4051-ADJ) 15 V
Power dissipation (TA = 25°C)(2) M3 package 280 mW
Lead temperature M3 packages Vapor phase (60 seconds) 215 °C
Infrared (15 seconds) 220
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax= (TJmax −TA )/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4051-N, TJmax = 125°̊C, and the typical thermal resistance (θJA), when board mounted, is 280°C/W for the SOT-23 package.
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