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ZHCSIW9I April 2004 – October 2018 LM5008

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		LM5008		UNIT
		DGK (VSSOP)	NGU (WSON)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	139.7	42	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.2	27.6	°C/W
R_θJB	Junction-to-board thermal resistance	70.5	18.5	°C/W
ψ_JT	Junction-to-top characterization parameter	3.4	0.3	°C/W
ψ_JB	Junction-to-board characterization parameter	69.5	18.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	4.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.