ZHCSIW9I April   2004  – October 2018 LM5008

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      典型应用电路和方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
      2. 7.3.2 High Voltage Start-Up Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator and Shutdown
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum Load Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 11.1.2 使用 WEBENCH® 工具创建定制设计方案
      3. 11.1.3 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
        1. 11.2.1.1 PCB 布局资源
        2. 11.2.1.2 热设计资源
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The LM5008 regulation and overvoltage comparators are very fast, and as such responds to short-duration noise pulses. Layout considerations are therefore critical for optimum performance:

  1. Minimize the area of the high di/dt switching current loop consisting of the VIN pin, input ceramic capacitor, SW node and freewheeling power diode. Keep the input capacitor as close as possible to the VIN pin and route a short, direct connection to the RTN pin using polygon copper pours.
  2. Minimize SW copper area to reduce radiated noise related to high dv/dt.
  3. Locate all components as physically close as possible to their respective pins, thereby minimizing noise pickup in the printed-circuit tracks.
  4. Locate the FB trace away from noise sources and inductors. Place the resistor close to the FB pin to minimize the length of the FB trace.

If the internal dissipation of the LM5008 converter produces excessive junction temperatures during normal operation, optimal use of the PCB ground plane can help considerably to dissipate heat. The exposed pad on the bottom of the WSON-8 package can be soldered to a ground plane on the PCB, and that plane should extend out from beneath the IC to help dissipate the heat. Additionally, the use of wide PCB traces for power connection can also help conduct heat away from the IC. Judicious positioning of the LM5008 converter within the end product, along with use of any available air flow (forced or natural convection), can help reduce the operating junction temperature.