ZHCSNT4I February   2006  – May 2021 LM5009

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 High Voltage Startup Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Resistor Divider Selection
        2. 8.2.2.2 Frequency Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 VCC and Bootstrap Capacitor
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Current Limit Off-Timer Setting
        7. 8.2.2.7 Rectifier Diode Selection
        8. 8.2.2.8 Input Capacitor Selection
        9. 8.2.2.9 Ripple Configuration
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)LM5009UNIT
DGK (VSSOP)NGU (WSON)
8 PINS8 PINS
RθJAJunction-to-ambient thermal resistance157.742.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance50.241.5°C/W
RθJBJunction-to-board thermal resistance77.920.1°C/W
ψJTJunction-to-top characterization parameter4.50.4°C/W
ψJBJunction-to-board characterization parameter76.520.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/a4.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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