ZHCSES8 March   2016 LM5022-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM5022-Q1
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Voltage Start-Up Regulator
      2. 7.3.2 Input Undervoltage Detector
      3. 7.3.3 Error Amplifier
      4. 7.3.4 Current Sensing and Current Limiting
      5. 7.3.5 PWM Comparator and Slope Compensation
      6. 7.3.6 Soft Start
      7. 7.3.7 MOSFET Gate Driver
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Oscillator, Shutdown, and SYNC
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  MOSFET
        3. 8.2.2.3  Output Diode
        4. 8.2.2.4  Boost Inductor
        5. 8.2.2.5  Output Capacitor
        6. 8.2.2.6  VCC Decoupling Capacitor
        7. 8.2.2.7  Input Capacitor
        8. 8.2.2.8  Current Sense Filter
        9. 8.2.2.9  RSNS, RS2 and Current Limit
        10. 8.2.2.10 Control Loop Compensation
        11. 8.2.2.11 Efficiency Calculations
          1. 8.2.2.11.1 Chip Operating Loss
          2. 8.2.2.11.2 MOSFET Switching Loss
          3. 8.2.2.11.3 MOSFET and RSNS Conduction Loss
          4. 8.2.2.11.4 Output Diode Loss
          5. 8.2.2.11.5 Input Capacitor Loss
          6. 8.2.2.11.6 Output Capacitor Loss
          7. 8.2.2.11.7 Boost Inductor Loss
          8. 8.2.2.11.8 Total Loss
          9. 8.2.2.11.9 Efficiency
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Filter Capacitors
      2. 10.1.2 Sense Lines
      3. 10.1.3 Compact Layout
      4. 10.1.4 Ground Plane and Shape Routing
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 设计支持
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

日期 修订版本 注释
2016 年 3 月 * 首次发布。