SNVS344B March   2005  – December 2014 LM5032

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Line Undervoltage Lock Out, UVLO, Shutdown
      2. 7.3.2  Startup Regulator, VIN, VCC
      3. 7.3.3  Drivers Off, VCC Disable
      4. 7.3.4  Oscillator
      5. 7.3.5  PWM Comparator/Slope Compensation
      6. 7.3.6  Cycle-by-Cycle Current Limit
      7. 7.3.7  Hiccup Mode Current Limit Restart
      8. 7.3.8  Soft-Start
      9. 7.3.9  Output Duty Cycle
      10. 7.3.10 Driver Outputs
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  VIN
      2. 8.1.2  For Applications > 100 V
      3. 8.1.3  UVLO
      4. 8.1.4  VCC
      5. 8.1.5  Oscillator, Sync Input
      6. 8.1.6  Voltage Feedback, COMP1, COMP2
      7. 8.1.7  Current Sense, CS1, CS2
      8. 8.1.8  Hiccup Mode Current Limit Restart
      9. 8.1.9  Soft-Start
      10. 8.1.10 Line Voltage Dependent Maximum Duty Cycle
      11. 8.1.11 User Defined Max Duty Cycle
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Oscillator Frequency and Maximum Duty Cycle
        2. 8.2.2.2 Power Stage Design
          1. 8.2.2.2.1 Boost Inductor Selection
          2. 8.2.2.2.2 Output Capacitor Selection
          3. 8.2.2.2.3 Boost MOSFET Selection
          4. 8.2.2.2.4 Boost Diode Selection
        3. 8.2.2.3 UVLO Setting
        4. 8.2.2.4 VIN, VCC, Startup
        5. 8.2.2.5 Soft-Start and Overload
        6. 8.2.2.6 Current Sense
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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