ZHCSLQ5D October   2007  – August 2020 LM5067

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Up Sequence
      2. 8.3.2 Gate Control
      3. 8.3.3 Current Limit
      4. 8.3.4 Circuit Breaker
      5. 8.3.5 Power Limit
      6. 8.3.6 Fault Timer and Restart
      7. 8.3.7 Undervoltage Lock-Out (UVLO)
      8. 8.3.8 Overvoltage Lock-Out (OVLO)
      9. 8.3.9 Power Good Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown / Enable Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  RIN, CIN
        2. 9.2.2.2  Current Limit, RS
        3. 9.2.2.3  Power Limit Threshold
        4. 9.2.2.4  Turn-On Time
          1. 9.2.2.4.1 Turn-on With Current Limit Only
          2. 9.2.2.4.2 Turn-on With Power Limit and Current Limit
        5. 9.2.2.5  MOSFET Selection
        6. 9.2.2.6  Timer Capacitor, CT
          1. 9.2.2.6.1 Insertion Delay
          2. 9.2.2.6.2 Fault Timeout Period
          3. 9.2.2.6.3 Restart Timing
        7. 9.2.2.7  UVLO, OVLO
          1. 9.2.2.7.1 Option A:
          2. 9.2.2.7.2 Option B:
          3. 9.2.2.7.3 Option C:
          4. 9.2.2.7.4 Option D:
        8. 9.2.2.8  Thermal Considerations
        9. 9.2.2.9  System Considerations
          1. 9.2.2.9.1 System Considerations During Surge Events
        10. 9.2.2.10 Power Good Pin
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Operating Voltage
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)(2)LM5067UNIT
VSSOPSOIC
10 PINS14 PINS
RθJAJunction-to-ambient thermal resistance9490°C/W
RθJCJunction-to-case thermal resistance4427
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
(2) Tested on a 4 layer JEDEC board with 2 vias under the package. See JEDEC standards JESD51-7 and JESD51-3. See the Thermal Considerations section.
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