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ZHCSJQ0A may 2019 – july 2023 LM5108

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM5108	UNIT
		DRC
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	47.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	50.3	°C/W
R_θJB	Junction-to-board thermal resistance	21.3	°C/W
ψ_JT	Junction-to-top characterization parameter	1.0	°C/W
ψ_JB	Junction-to-board characterization parameter	21.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.