ZHCSEL1C May   2012  – Februrary 2016 LM5134

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input-to-Output Logic
        2. 8.2.2.2 Input Threshold Type
        3. 8.2.2.3 VDD Bias Supply Voltage
        4. 8.2.2.4 Peak Source and Sink Currents
        5. 8.2.2.5 Enable and Disable Function
        6. 8.2.2.6 Propagation Delay
        7. 8.2.2.7 PILOT MOSFET Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11器件和文档支持
    1. 11.1 社区资源
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DBV Package, NGG Package
6-Pin SOT-23, 6-Pin WSON
Top View
LM5134 30192802.gif

Pin Functions

PIN I/O DESCRIPTION APPLICATION INFORMATION
NAME NO.
VDD 1 Gate drive supply Locally decouple to VSS using low ESR/ESL capacitor located as close as possible to the IC.
PILOT 2 O Gate drive output for an external turnoff FET Connect to the gate of a small turnoff MOSFET with a short, low inductance path. The turnoff FET provides a local turnoff path.
OUT 3 O Gate drive output for the power FET Connect to the gate of the power FET with a short, low inductance path. A gate resistor can be used to eliminate potential gate oscillations.
VSS 4 Ground All signals are referenced to this ground.
INB 5 I Inverting logic input Connect to VSS when not used.
IN 6 I Non-inverting logic input Connect to VDD when not used.
EP EP Exposed Pad It is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PC board, and that ground plane extend out from beneath the IC to help dissipate heat.