100% automated visual inspection (AVI) post-assembly is typically required to meet requirements for high reliability and robustness. Standard quad-flat no-lead (QFN) packages do not have solderable or exposed pins and terminals that are easily viewed. It is therefore difficult to visually determine whether or not the package is successfully soldered onto the printed-circuit board (PCB). The wettable-flank process was developed to resolve the issue of side-lead wetting of leadless packaging. The LM5143-Q1 is assembled using a 40-pin VQFNP package with wettable flanks to provide a visual indicator of solderability, which reduces the inspection time and manufacturing costs.