ZHCSNB3 February   2023 LM5148-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
    1. 6.1 Wettable Flanks
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings 
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN)
      2. 8.3.2  High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA)
      3. 8.3.3  Precision Enable (EN)
      4. 8.3.4  Power-Good Monitor (PG)
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Dual Random Spread Spectrum (DRSS)
      7. 8.3.7  Soft Start
      8. 8.3.8  Output Voltage Setpoint (FB)
      9. 8.3.9  Minimum Controllable On Time
      10. 8.3.10 Error Amplifier and PWM Comparator (FB, EXTCOMP)
      11. 8.3.11 Slope Compensation
      12. 8.3.12 Inductor Current Sense (ISNS+, VOUT)
        1. 8.3.12.1 Shunt Current Sensing
        2. 8.3.12.2 Inductor DCR Current Sensing
      13. 8.3.13 Hiccup Mode Current Limiting
      14. 8.3.14 High-Side and Low-Side Gate Drivers (HO, LO)
      15. 8.3.15 Output Configurations (CNFG)
      16. 8.3.16 Single-Output Dual-Phase Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
      2. 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC)
      3. 8.4.3 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Power Train Components
        1. 9.1.1.1 Buck Inductor
        2. 9.1.1.2 Output Capacitors
        3. 9.1.1.3 Input Capacitors
        4. 9.1.1.4 Power MOSFETs
        5. 9.1.1.5 EMI Filter
      2. 9.1.2 Error Amplifier and Compensation
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High Efficiency 2.1-MHz Synchronous Buck Regulator
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Custom Design with Excel Quickstart Tool
          3. 9.2.1.2.3 Buck Inductor
          4. 9.2.1.2.4 Current-Sense Resistance
          5. 9.2.1.2.5 Output Capacitors
          6. 9.2.1.2.6 Input Capacitors
          7. 9.2.1.2.7 Frequency Set Resistor
          8. 9.2.1.2.8 Feedback Resistors
          9. 9.2.1.2.9 Compensation Components
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – High Efficiency 48-V to 12-V 400-kHz Synchronous Buck Regulator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Design 3 – High Efficiency 440-kHz Synchronous Buck Regulator
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Design 4 – Dual-Phase 400-kHz 20-A Synchronous Buck Regulator
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Power Stage Layout
        2. 9.4.1.2 Gate-Drive Layout
        3. 9.4.1.3 PWM Controller Layout
        4. 9.4.1.4 Thermal Design and Layout
        5. 9.4.1.5 Ground Plane Design
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design with WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
        1. 10.2.1.1 PCB Layout Resources
        2. 10.2.1.2 Thermal Design Resources
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) UNIT
RGY (VQFN)
24 PINS
RθJA Junction-to-ambient thermal resistance 37.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 32 °C/W
RθJB Junction-to-board thermal resistance 15.5 °C/W
ψJT Junction-to-top characterization parameter 1.2 °C/W
ψJB Junction-to-board characterization parameter 15.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance  5.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics
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