ZHCSGU1C September 2017 – October 2021 LM5150-Q1
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Enable (EN Pin)
- 8.3.2 High Voltage VCC Regulator (PVCC, AVCC Pin)
- 8.3.3 Power-On Voltage Selection (VSET Pin)
- 8.3.4 Switching Frequency (RT Pin)
- 8.3.5 Clock Synchronization (SYNC Pin in SS Configuration)
- 8.3.6 Current Sense, Slope Compensation, and PWM (CS Pin)
- 8.3.7 Current Limit (CS Pin)
- 8.3.8 Feedback and Error Amplifier (COMP Pin)
- 8.3.9 Automatic Wake-Up and Standby
- 8.3.10 Boost Status Indicator (STATUS Pin)
- 8.3.11 Maximum Duty Cycle Limit, Minimum Input Supply Voltage
- 8.3.12 MOSFET Driver (LO Pin)
- 8.3.13 Thermal Shutdown
- 8.4 Device Functional Modes
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Custom Design With WEBENCH® Tools
- 9.2.2.2 RSET Resistor
- 9.2.2.3 RT Resistor
- 9.2.2.4 Inductor Selection (LM)
- 9.2.2.5 Current Sense (RS)
- 9.2.2.6 Slope Compensation Ramp (RSL)
- 9.2.2.7 Output Capacitor (COUT)
- 9.2.2.8 Loop Compensation Component Selection and Maximum ESR
- 9.2.2.9 PVCC Capacitor, AVCC Capacitor, and AVCC Resistor
- 9.2.2.10 VOUT Filter (CVOUT, RVOUT)
- 9.2.2.11 Input Capacitor
- 9.2.2.12 MOSFET Selection
- 9.2.2.13 Diode Selection
- 9.2.2.14 Efficiency Estimation
- 9.2.3 Application Curves
- 9.3 System Examples
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |