ZHCSPX4A February   2022  – April 2022 LM5152-Q1 , LM51521-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Device Enable/Disable (EN, VH Pin)
      2. 9.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 9.3.3  Light Load Switching Mode Selection (MODE Pin)
      4. 9.3.4  Line Undervoltage Lockout (UVLO Pin)
      5. 9.3.5  Fast Restart Using VCC HOLD (VH Pin)
      6. 9.3.6  Adjustable Output Regulation Target (VOUT, TRK, VREF Pin)
      7. 9.3.7  Overvoltage Protection (VOUT Pin)
      8. 9.3.8  Boost Status Indicator (STATUS Pin)
      9. 9.3.9  Dynamically Programmable Switching Frequency (RT)
      10. 9.3.10 External Clock Synchronization (SYNC Pin)
      11. 9.3.11 Programmable Spread Spectrum (DITHER Pin)
      12. 9.3.12 Programmable Soft Start (SS Pin)
      13. 9.3.13 Wide Bandwidth Transconductance Error Amplifier and PWM (TRK, COMP Pin)
      14. 9.3.14 Current Sensing and Slope Compensation (CSP, CSN Pin)
      15. 9.3.15 Constant Peak Current Limit (CSP, CSN Pin)
      16. 9.3.16 Maximum Duty Cycle and Minimum Controllable On-Time Limits
      17. 9.3.17 Deep Sleep Mode and Bypass Operation (HO, CP Pin)
      18. 9.3.18 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB Pin)
      19. 9.3.19 Thermal Shutdown Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Status
        1. 9.4.1.1 Shutdown Mode
        2. 9.4.1.2 Configuration Mode
        3. 9.4.1.3 Active Mode
        4. 9.4.1.4 Sleep Mode
        5. 9.4.1.5 Deep Sleep Mode
      2. 9.4.2 Light Load Switching Mode
        1. 9.4.2.1 Forced PWM (FPWM) Mode
        2. 9.4.2.2 Diode Emulation (DE) Mode
        3. 9.4.2.3 Forced Diode Emulation Operation in FPWM Mode
        4. 9.4.2.4 Skip Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Application Ideas
      3. 10.2.3 Application Curves
    3. 10.3 System Example
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3.19 Thermal Shutdown Protection

An internal thermal shutdown (TSD) is provided to protect the device if the junction temperature (TJ) exceeds 175°C. When TSD is activated, the device is forced into a low-power thermal shutdown state with the MOSFET drivers and the VCC regulator disabled. After the TJ is reduced (typical hysteresis is 15⁰C), the device restarts. The TSD is disabled during sleep or deep sleep mode.

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