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ZHCSPX4A February 2022 – April 2022 LM5152-Q1 , LM51521-Q1

PRODUCTION DATA

8.4 Thermal Information

THERMAL METRIC⁽¹⁾		RGR (QFN)	UNIT
THERMAL METRIC⁽¹⁾		20 PINS	UNIT
R_qJA	Junction-to-ambient thermal resistance	43.3	°C/W
R_qJC(top)	Junction-to-case (top) thermal resistance	39.9	°C/W
R_qJB	Junction-to-board thermal resistance	17.8	°C/W
y_JT	Junction-to-top characterization parameter	0.8	°C/W
y_JB	Junction-to-board characterization parameter	17.8	°C/W
R_qJC(bot)	Junction-to-case (bottom) thermal resistance	5.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.