ZHCSOB0A july   2021  – august 2023 LM5157

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Line Undervoltage Lockout (UVLO/SYNC/EN Pin)
      2. 8.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 8.3.3  Soft Start (SS Pin)
      4. 8.3.4  Switching Frequency (RT Pin)
      5. 8.3.5  Dual Random Spread Spectrum – DRSS (MODE Pin)
      6. 8.3.6  Clock Synchronization (UVLO/SYNC/EN Pin)
      7. 8.3.7  Current Sense and Slope Compensation
      8. 8.3.8  Current Limit and Minimum On Time
      9. 8.3.9  Feedback and Error Amplifier (FB, COMP Pin)
      10. 8.3.10 Power-Good Indicator (PGOOD Pin)
      11. 8.3.11 Hiccup Mode Overload Protection (MODE Pin)
      12. 8.3.12 Maximum Duty Cycle Limit and Minimum Input Supply Voltage
      13. 8.3.13 Internal MOSFET (SW Pin)
      14. 8.3.14 Overvoltage Protection (OVP)
      15. 8.3.15 Thermal Shutdown (TSD)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Run Mode
        1. 8.4.3.1 Spread Spectrum Enabled
        2. 8.4.3.2 Hiccup Mode Protection Enabled
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Recommended Components
        3. 9.2.2.3 Inductor Selection (LM)
        4. 9.2.2.4 Output Capacitor (COUT)
        5. 9.2.2.5 Input Capacitor
        6. 9.2.2.6 Diode Selection
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
      3. 12.1.3 Export Control Notice
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) LM5157x UNIT
RTE(QFN)
16 PINS
RθJA Junction-to-ambient thermal resistance (LM5157EVM-BST) 32.7 °C/W
RθJA Junction-to-ambient thermal resistance 44.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.1 °C/W
RθJB Junction-to-board thermal resistance 17.3 °C/W
ΨJT Junction-to-top characterization parameter (LM5157EVM-BST) 0.6 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
ΨJB Junction-to-board characterization parameter (LM5157EVM-BST) 14.8 °C/W
ΨJB Junction-to-board characterization parameter 17.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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