ZHCSPF2A December   2021  – September 2022 LM5168 , LM5169

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Architecture
      2. 8.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 8.3.3  Internal Soft Start
      4. 8.3.4  On-Time Generator
      5. 8.3.5  Current Limit
      6. 8.3.6  N-Channel Buck Switch and Driver
      7. 8.3.7  Synchronous Rectifier
      8. 8.3.8  Enable, Undervoltage Lockout (EN/UVLO)
      9. 8.3.9  Power Good (PGOOD)
      10. 8.3.10 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Fly-Buck™ Converter Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency (RT)
        2. 9.2.2.2  Transformer Selection
        3. 9.2.2.3  Output Capacitor Selection
        4. 9.2.2.4  Secondary Output Diode
        5. 9.2.2.5  Setting Output Voltage
        6. 9.2.2.6  Input Capacitor
        7. 9.2.2.7  Type-3 Ripple Network
        8. 9.2.2.8  CBST Selection
        9. 9.2.2.9  Minimum Secondary Output Load
        10. 9.2.2.10 Example Design Summary
      3. 9.2.3 Application Curves
    3. 9.3 Typical Buck Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Switching Frequency (RT)
        2. 9.3.2.2 Buck Inductor Selection
        3. 9.3.2.3 Setting the Output Voltage
        4. 9.3.2.4 Type-3 Ripple Network
        5. 9.3.2.5 Output Capacitor Selection
        6. 9.3.2.6 Input Capacitor Considerations
        7. 9.3.2.7 CBST Selection
        8. 9.3.2.8 Example Design Summary
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Thermal Considerations
      2. 9.5.2 Typical EMI Results
      3. 9.5.3 Layout Guidelines
        1. 9.5.3.1 Compact PCB Layout for EMI Reduction
        2. 9.5.3.2 Feedback Resistors
      4. 9.5.4 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.3.10 Thermal Protection

The LM516x includes an internal junction temperature monitor to protect the device in the event of higher than normal junction temperature. If the junction temperature exceeds 175°C (typical), thermal shutdown occurs to prevent further power dissipation and temperature rise. The LM516x initiates a restart sequence when the junction temperature falls to 165°C, based on a typical thermal shutdown hysteresis of 10°C. This protection is a non-latching protection, so the device cycles into and out of thermal shutdown if the fault persists.
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