ZHCSPF2B December   2021  – December 2024 LM5168 , LM5169

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Architecture
      2. 7.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 7.3.3  Internal Soft Start
      4. 7.3.4  On-Time Generator
      5. 7.3.5  Current Limit
      6. 7.3.6  N-Channel Buck Switch and Driver
      7. 7.3.7  Synchronous Rectifier
      8. 7.3.8  Enable, Undervoltage Lockout (EN/UVLO)
      9. 7.3.9  Power Good (PGOOD)
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Sleep Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Fly-Buck™ Converter Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency (RT)
        2. 8.2.2.2  Transformer Selection
        3. 8.2.2.3  Output Capacitor Selection
        4. 8.2.2.4  Secondary Output Diode
        5. 8.2.2.5  Setting Output Voltage
        6. 8.2.2.6  Input Capacitor
        7. 8.2.2.7  Type-3 Ripple Network
        8. 8.2.2.8  CBST Selection
        9. 8.2.2.9  Minimum Secondary Output Load
        10. 8.2.2.10 Example Design Summary
      3. 8.2.3 Application Curves
    3. 8.3 Typical Buck Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Switching Frequency (RT)
        2. 8.3.2.2 Buck Inductor Selection
        3. 8.3.2.3 Setting the Output Voltage
        4. 8.3.2.4 Type-3 Ripple Network
        5. 8.3.2.5 Output Capacitor Selection
        6. 8.3.2.6 Input Capacitor Considerations
        7. 8.3.2.7 CBST Selection
        8. 8.3.2.8 Example Design Summary
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Thermal Considerations
      2. 8.5.2 Typical EMI Results
      3. 8.5.3 Layout Guidelines
        1. 8.5.3.1 Compact PCB Layout for EMI Reduction
        2. 8.5.3.2 Feedback Resistors
      4. 8.5.4 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方米6体育平台手机版_好二三四免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision A (September 2022) to Revision B (December 2024)

  • 更新了器件信息 表并添加了新的封装Go
  • Added new package and supporting informationGo
  • Added new package pinout drawingGo
  • Deleted "DC" from "SW" in the Absolute Maximum Ratings table and added a footnote that links to the Layout Guidelines sectionGo
  • Deleted VIN = 4.5V to 120V in the Electrical Characteristics table headerGo
  • Added the new package informationGo
  • Added the information for NGU packageGo
  • Added EMI curves for NGU packageGo

Changes from Revision * (December 2021) to Revision A (September 2022)
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